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Type: Chip
Package: 2DIL
Mounting: Through Hole
MSL Level: MSL 4 - 72 hours
Pin Count: 2
Wavelength: 850 nm
Lead Finish: Matte Tin
Supplier Package: DIP
Maximum Fall Time: 20 ns
Maximum Rise Time: 20 ns
Photo Sensitivity: 0.62 A/W
Product Dimensions: 4.5 x 4 x 2.2 mm
Max Processing Temp: 260
Photodiode Material: Si
Maximum Dark Current: 30 nA
Operating Temperature: -40 to 100 °C
Maximum Fall Time Range: 15 to 250 ns
Maximum Rise Time Range: 15 to 250 ns
