
congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
Manufacturer: congatec Model: conga-QMX6/HSP3-T - Contact
Designed for: BGA
Mounting Style: Screw
- Quality Engagement
- Easy change and return
- Delivery Avaliable
- Favorable payment