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congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.

Designed for: BGA

Mounting Style: Screw

  • Quality Engagement
  • Easy change and return
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  • Favorable payment

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