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Pitch: 1.27 mm (0.05 in)
Data Rate: 3 Gbps
Stack Height: 13.65 mm
Current Rating: 1.1 A
Mounting Angle: Vertical
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 3 Gbps
Termination Style: Solder
Number of Positions: 50 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
