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Pitch: 1.75 mm (0.069 in)
Application: Board to Board Interposer
Stack Height: 25 mm
Current Rating: 1 A
Mounting Angle: Straight
Number of Rows: 60 Row
Voltage Rating: 50 V
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Polypropylene (PP)
Termination Style: Solder Balls
Flammability Rating: UL 94 V-0
Number of Positions: 300 Position
Insulation Resistance: 1 GOhms
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
