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Pitch: 1.27 mm
Features: SIP interconnect socket
Case Style: SIP
Unit Weight: 3.062 g
Current Rating: 3 A
Mounting Style: Through Hole
Number of Rows: 1 Row
Voltage Rating: 1 kV
Contact Plating: Gold
Contact Material: Beryllium Copper
Housing Material: Thermoplastic
Termination Style: Solder Tail
Number of Positions: 50 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
