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Type: High-Speed CAN Core System Basis Chip
Package: 32HTSSOP
Category: High-Speed CAN Core System Basis Chip
Mounting: Surface Mount
Rad Hard: 0
MSL Level: MSL 1 - Unlimited
Pin Count: 32
Lead Finish: Gold over Nickel Palladium|Silver
Screening Level: Automotive
Supplier Package: HTSSOP
Power Supply Type: Analog
Product Dimensions: 11.1 x 6.2 x 0.95 mm
Max Processing Temp: 260 °C
Operating Temperature: -40 to 125 °C
Operating Supply Current: 0.082 mA
