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Optical imaging system
Top/bottom camera: 5 MP/12MP high-speed camera
Light source: Multi-angle high intensity light source
Optical resolution: 4.3μm/10μm/15μm/20μm
Inspection speed: Up to 171CM²/s（15um)
Defect inspection
Component defect: Missing parts, tombstoning, billboard, polarity, rotation, skew, OCV, damage, reverse, tilt, foreign matter, solder float, component height
Soldering joint defect: Icicle, hole, solder bead, pad with less/more solder, bridging, warping, gold finger pollution/scratches, solder joint height, volume, sectional area, roundness
Mini Led defect: multiple die, missing die, upside down, reversed, shift, billboard, die lifting, rotation, dead led, foreign matter, internal shorting, solder shorting, cold soldering
X-Y-Z axis control system: High-precision ball screw drive
X-Y-Z axis control accuracy: 10 μm
Min PCB carrier size: 50 x 50 mm
Max PCB carrier size:
Single track: 470 x 510 mm
Dual track: 510x580mm (Enable single track）
510X330mm (Enable dual track）
PCB measurable thickness: 0.6-5 mm
PCB conveyor height: 880-920 mm
Conveyor loading weight: 8 kg
Conveyor width adjustment/conveying: Automatic width adjustment, belt conveying
Height limit of passable component:
Top A200T/T-D： 28-50mm adjustable
Bottom A200T/T-D： 60mm
Side 3 mm
Weight: 750 kg/-D model 900kg
Power requirements: 200-240 V, single phase, 50/60 Hz, 3 kVA
Air source: 5-6 bar
Software: Offline programming software, maintenance station software, SPC, MES docking software, deep learning software (optional)
