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Optical imaging system:
Camera : 5 MP high-speed camera
Light source : Multi-angle high white light
Optical resolution : 10μm 15μm 20μm
Inspection speed : Scan speed 320mm/S Scan speed 430mm/S Scan speed 570mm/S
Programming mode : Manual programming, CAD data import, AI programming
Defect inspection:
Component defect : Deviation, missing parts, skew, tombstoning, inverted, overturned, wrong parts, damage, polarity
Soldering joint defect : Icicle, hole, solder bead, solder pad with less/more solder, bridging, warping, gold finger pollution/scratches
Mini Led defect : multiple die、 missing die、 upside down、 reversed、 shift、 billboard、 die lifting、 rotation、 dead led、 foreign matter、internal shorting、 solder shorting、 cold soldering
X-Y-Z axis control system : High-precision ball screw drive, Z axis range 50mm
X-Y-Z axis control accuracy : 10 μm
PCB carrier size : 50×50mm(Min)～ 470×510mm(Max)
PCB curvature : < 5mm or 2% of PCB diagonal length
PCB measurable thickness : 0.6-5 mm
PCB conveyor height : 880-920 mm
PCB flow direction : Left in and right out, right in and left out (factory setting)
Conveyor loading weight : 5 kg
Conveyor width adjustment/conveying : Automatic width adjustment, belt conveying
Height limit of passable component:
Top : 78 mm
Bottom : 40 mm
Side : 3 mm
Weight : About 750 kg
Machine sizes : 1000*1350*1650mm
Power requirements : 200-240 V, single phase, 50/60 Hz, 3 kVA
Air source : 5-6 bar
Machine safety : Meet CE standards
Software: Offline programming software, maintenance station & SPC management system (optional), deep learning system (optional), barcode system (optional), 3D line scan camera (optional)
