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Manufacturer: Universal Instruments - USA
Model: FuzionSC Platform
Warranty: 12 months
Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits?
Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.
Silicon/SMT, high-accuracy/high-speed assembly
High accuracy: (±10µm, < 3µm placement repeatability)
Dual- or single-beam, multiple-spindle heads
Full range of die and component types and sizes
Versatile substrate handling
Broadest range of feeding platforms
Low-maintenance, accurate over time
Vision robustness recognition of pins or logic pads
Stacking support (POP)
Low-force capability
